One of the things I've been seeking out are the PCB capabilities. I have two boards I need to make, one 4 layer and one 6 layer, the 6 layer having 0.4mm pitch BGA's if I can cost benefit justify it.
I'm not finding that information easily so it's a barrier to me getting past the intro.
Are there links to this as well as a component library FAQ?
Yes, and if they support blind/buried vias, etc. they'll also need to have various options to select enig/hasl, lead/lead-free, board outlines, cutouts allowed, soldermask colors, etc.. And presumably they've got the price baked in for various combinations of through-hold and smd components on both sides of the board. And 16 days of lead time seems like not necessarily a rush job, but some things can take longer, and I won't care, but it might be an opportunity to save money.
Most of the parameters are contained in the EDA files, so we extract track/gap, pcb height, via config etc. This is pretty cool as you can make sure your design file is the master for all this info.
Unfortunately there are a few things most tools don't support yet, like finish and solder mask colour, so we will be adding GUI to change them.
Nonetheless it would be useful to know whether you can service requirements like sub 0.1mm track width, HDI, sub 0.2mm hole size and so on. I'll experiment and put something small but tricky through and see what comes out.
The super high end board spec's will have delayed quoting for now (probably an hour or two). But each time we quote we learn from it, over time all specs will be instant.
oh btw we account for how different parameters effect lead time. You'll for instance see if you simplify your design you might get a quicker lead time.
I'm not finding that information easily so it's a barrier to me getting past the intro.
Are there links to this as well as a component library FAQ?
Very useful idea though.